Corrosion and leaching behaviours of Sn-0.7Cu-0.05Ni lead-free solder in 3.5 wt.% NaCl solution

• Main Authors: Guerrero, Jan Ervin C., Camacho, Drexel H., Mokhtari, Omid, Nishikawa, Hiroshi
• Format: text
• Published: Animo Repository 2018
• Subjects: Corrosion and anti-corrosives; Leaching; Copper alloys; Solder and soldering; Nickel alloys; Sodium alloys; Ternary alloys; Salt; Chemistry
• Online Access: https://animorepository.dlsu.edu.ph/faculty_research/3673; https://animorepository.dlsu.edu.ph/context/faculty_research/article/4675/type/native/viewcontent/6580750.html
• Institution: De La Salle University

The corrosion and leaching behaviour of a new ternary Sn-0.7Cu-0.05Ni alloy in 3.5 wt.% NaCl solution is reported herein. Potentiodynamic polarization measurements show that Sn-0.7Cu-0.05Ni has the highest corrosion rate. Results of the 30-day Sn leaching measurement show that Sn-Cu-Ni joint has sli...