Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications

Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications

10.1016/j.tsf.2005.09.072

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Bibliographic Details
Main Authors: Kumar, K.M., Kripesh, V., Shen, L., Tay, A.A.O.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Microstructure
Solder alloys
SWCNTs
Tensile strength
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73889
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/73889

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