Influence of single-wall carbon nanotube addition on the microstructural and tensile properties of Sn-Pb solder alloy

by Kumar, K.M., Kripesh, V., Tay, A.A.O.
Published 2014

Single-wall carbon nanotube (SWCNT) functionalized Sn-Ag-Cu lead-free composite solders

by Kumar, K.M., Kripesh, V., Tay, A.A.O.
Published 2014

Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications

by Kumar, K.M., Kripesh, V., Shen, L., Tay, A.A.O.
Published 2014

Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

by Rao, B.S.S.C., Kumar, K.M., Kripesh, V., Zeng, K.Y.
Published 2014

Nanoindentation study of Zn-based Pb free solders used in fine pitch interconnect applications

by Kumar, K.M., Kripesh, V., Shen, L., Zeng, K., Tay, A.A.O.
Published 2014