Diffusion kinetics and mechanical behavior of lead-free microbump solder joints in 3D packaging applications

بواسطة Rao, B.S.S.C., Kripesh, V., Zeng, K.Y.
منشور في 2014

Tensile deformation behavior of nano-sized Mo particles reinforced SnAgCu solders

بواسطة Rao, B.S.S.C., Kumar, K.M., Kripesh, V., Zeng, K.Y.
منشور في 2014