Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications
10.1016/j.tsf.2005.09.072
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2014
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sg-nus-scholar.10635-738892023-10-30T09:56:59Z Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications Kumar, K.M. Kripesh, V. Shen, L. Tay, A.A.O. MECHANICAL ENGINEERING Microstructure Solder alloys SWCNTs Tensile strength 10.1016/j.tsf.2005.09.072 Thin Solid Films 504 1-2 371-378 THSFA 2014-06-19T05:40:34Z 2014-06-19T05:40:34Z 2006-05-10 Conference Paper Kumar, K.M., Kripesh, V., Shen, L., Tay, A.A.O. (2006-05-10). Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications. Thin Solid Films 504 (1-2) : 371-378. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2005.09.072 00406090 http://scholarbank.nus.edu.sg/handle/10635/73889 000236486200085 Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| topic |
Microstructure Solder alloys SWCNTs Tensile strength |
| spellingShingle |
Microstructure Solder alloys SWCNTs Tensile strength Kumar, K.M. Kripesh, V. Shen, L. Tay, A.A.O. Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications |
| description |
10.1016/j.tsf.2005.09.072 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Kumar, K.M. Kripesh, V. Shen, L. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Kumar, K.M. Kripesh, V. Shen, L. Tay, A.A.O. |
| author_sort |
Kumar, K.M. |
| title |
Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications |
| title_short |
Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications |
| title_full |
Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications |
| title_fullStr |
Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications |
| title_full_unstemmed |
Study on the microstructure and mechanical properties of a novel SWCNT-reinforced solder alloy for ultra-fine pitch applications |
| title_sort |
study on the microstructure and mechanical properties of a novel swcnt-reinforced solder alloy for ultra-fine pitch applications |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73889 |
| _version_ |
1781783346090606592 |