Surfactant-free synthesis of copper particles for electrically conductive adhesive applications

by Ho, Li Ngee, Nishikawa, Hiroshi
Published 2013

Effect of different copper fillers on the electrical resistivity of conductive adhesives

by Li-Ngee, Ho, Nishikawa, Hiroshi, Takemoto, Tadashi
Published 2011

Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive

by Ho, Li Ngee, Tang, Fei Wu, Nishikawa, Hiroshi, Takemoto, Tadashi
Published 2010

Thermomechanical properties of Zeta (Ag₃In) phase

by Liu, Xunda, Tatsumi, Hiroaki, Jin, Zhi, Chen, Zhong, Nishikawa, Hiroshi
Published 2024

Corrosion and leaching behaviours of Sn-0.7Cu-0.05Ni lead-free solder in 3.5 wt.% NaCl solution

by Guerrero, Jan Ervin C., Camacho, Drexel H., Mokhtari, Omid, Nishikawa, Hiroshi
Published 2018

Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives

by Lin-Ngee, Ho, Teng, Fei Wu, Nishikawa, Hiroshi, Takemoto, Tadashi, Miyake, Koichi, Fujita, Masakazu, Ota, Koyu
Published 2011