Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes

In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperat...

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Bibliographic Details
Main Authors: Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/97817
http://hdl.handle.net/10220/18102
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Institution: Nanyang Technological University
Language: English