Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes

In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperat...

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Main Authors: Nai, S. M. L., Xu, L. Y., Wei, J., Han, Yongdian, Jing, Hongyang, Tan, Cher Ming
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2013
Subjects:
Online Access:https://hdl.handle.net/10356/97817
http://hdl.handle.net/10220/18102
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-978172020-03-07T12:47:12Z Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes Nai, S. M. L. Xu, L. Y. Wei, J. Han, Yongdian Jing, Hongyang Tan, Cher Ming School of Electrical and Electronic Engineering A*STAR SIMTech DRNTU::Engineering::Electrical and electronic engineering In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 to 100 mN increased the percentage reduction in creep strain rate from 4 to 28%, for the composite compared to SnAgCu solder after 300 s of holding. 2013-12-05T05:59:57Z 2019-12-06T19:47:03Z 2013-12-05T05:59:57Z 2019-12-06T19:47:03Z 2012 2012 Journal Article Han, Y., Jing, H., Nai, S. M. L., Xu, L. Y., Tan, C. M., & Wei, J. (2012). Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes. Journal of materials science : materials in electronics, 23(5), 1108-1115. https://hdl.handle.net/10356/97817 http://hdl.handle.net/10220/18102 10.1007/s10854-011-0557-9 en Journal of materials science : materials in electronics
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
topic DRNTU::Engineering::Electrical and electronic engineering
spellingShingle DRNTU::Engineering::Electrical and electronic engineering
Nai, S. M. L.
Xu, L. Y.
Wei, J.
Han, Yongdian
Jing, Hongyang
Tan, Cher Ming
Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
description In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 to 100 mN increased the percentage reduction in creep strain rate from 4 to 28%, for the composite compared to SnAgCu solder after 300 s of holding.
author2 School of Electrical and Electronic Engineering
author_facet School of Electrical and Electronic Engineering
Nai, S. M. L.
Xu, L. Y.
Wei, J.
Han, Yongdian
Jing, Hongyang
Tan, Cher Ming
format Article
author Nai, S. M. L.
Xu, L. Y.
Wei, J.
Han, Yongdian
Jing, Hongyang
Tan, Cher Ming
author_sort Nai, S. M. L.
title Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
title_short Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
title_full Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
title_fullStr Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
title_full_unstemmed Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
title_sort creep mitigation in sn–ag–cu composite solder with ni-coated carbon nanotubes
publishDate 2013
url https://hdl.handle.net/10356/97817
http://hdl.handle.net/10220/18102
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