Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperat...
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sg-ntu-dr.10356-978172020-03-07T12:47:12Z Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes Nai, S. M. L. Xu, L. Y. Wei, J. Han, Yongdian Jing, Hongyang Tan, Cher Ming School of Electrical and Electronic Engineering A*STAR SIMTech DRNTU::Engineering::Electrical and electronic engineering In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 to 100 mN increased the percentage reduction in creep strain rate from 4 to 28%, for the composite compared to SnAgCu solder after 300 s of holding. 2013-12-05T05:59:57Z 2019-12-06T19:47:03Z 2013-12-05T05:59:57Z 2019-12-06T19:47:03Z 2012 2012 Journal Article Han, Y., Jing, H., Nai, S. M. L., Xu, L. Y., Tan, C. M., & Wei, J. (2012). Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes. Journal of materials science : materials in electronics, 23(5), 1108-1115. https://hdl.handle.net/10356/97817 http://hdl.handle.net/10220/18102 10.1007/s10854-011-0557-9 en Journal of materials science : materials in electronics |
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DRNTU::Engineering::Electrical and electronic engineering Nai, S. M. L. Xu, L. Y. Wei, J. Han, Yongdian Jing, Hongyang Tan, Cher Ming Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes |
| description |
In the present study, the powder metallurgy route was used to successfully incorporate Ni-coated carbon nanotubes into SnAgCu solder, to form a nanocomposite solder. Nanoindentation tests were performed on both composite and SnAgCu solder samples to investigate their creep behaviour at room temperature. Characterization results revealed that with the addition of Ni-coated carbon nanotubes, the creep behaviour of composite solder improved significantly as compared to that of the unreinforced solder alloy. Moreover, increasing the maximum load from 20 to 100 mN increased the percentage reduction in creep strain rate from 4 to 28%, for the composite compared to SnAgCu solder after 300 s of holding. |
| author2 |
School of Electrical and Electronic Engineering |
| author_facet |
School of Electrical and Electronic Engineering Nai, S. M. L. Xu, L. Y. Wei, J. Han, Yongdian Jing, Hongyang Tan, Cher Ming |
| format |
Article |
| author |
Nai, S. M. L. Xu, L. Y. Wei, J. Han, Yongdian Jing, Hongyang Tan, Cher Ming |
| author_sort |
Nai, S. M. L. |
| title |
Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes |
| title_short |
Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes |
| title_full |
Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes |
| title_fullStr |
Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes |
| title_full_unstemmed |
Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes |
| title_sort |
creep mitigation in sn–ag–cu composite solder with ni-coated carbon nanotubes |
| publishDate |
2013 |
| url |
https://hdl.handle.net/10356/97817 http://hdl.handle.net/10220/18102 |
| _version_ |
1681047631635152896 |