Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-i censored data

• Main Authors: Mi, J, Li, Y.-F, Yang, Y.-J, Peng, W, Huang, H.-Z
• Other Authors: INDUSTRIAL SYSTEMS ENGINEERING AND MANAGEMENT
• Format: Article
• Published: 2020
• Subjects: acceleration; article; general device; packaging; prediction; reliability; solder joint; chemical model; chemistry; device failure analysis; electronics; heat; materials testing; scanning electron microscopy; copper; silver; tin derivative; Copper; Electronics; Equipment Failure Analysis; Hot Temperature; Materials Testing; Microscopy, Electron, Scanning; Models, Chemical; Silver; Tin Compounds
• Online Access: https://scholarbank.nus.edu.sg/handle/10635/183711
• Institution: National University of Singapore

10.1155/2014/807693