Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-i censored data
10.1155/2014/807693
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| Main Authors: | , , , , |
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| Other Authors: | |
| Format: | Article |
| Published: |
2020
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| Subjects: | |
| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/183711 |
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| Institution: | National University of Singapore |