Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-i censored data
10.1155/2014/807693
Saved in:
| Main Authors: | , , , , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Published: |
2020
|
| Subjects: | |
| Online Access: | https://scholarbank.nus.edu.sg/handle/10635/183711 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| Institution: | National University of Singapore |
| id |
sg-nus-scholar.10635-183711 |
|---|---|
| record_format |
dspace |
| spelling |
sg-nus-scholar.10635-1837112024-11-13T09:27:22Z Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-i censored data Mi, J Li, Y.-F Yang, Y.-J Peng, W Huang, H.-Z INDUSTRIAL SYSTEMS ENGINEERING AND MANAGEMENT acceleration article general device packaging prediction reliability solder joint chemical model chemistry device failure analysis electronics heat materials testing scanning electron microscopy copper silver tin derivative Copper Electronics Equipment Failure Analysis Hot Temperature Materials Testing Microscopy, Electron, Scanning Models, Chemical Silver Tin Compounds 10.1155/2014/807693 Scientific World Journal 2014 807693 2020-11-19T07:17:30Z 2020-11-19T07:17:30Z 2014 Article Mi, J, Li, Y.-F, Yang, Y.-J, Peng, W, Huang, H.-Z (2014). Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-i censored data. Scientific World Journal 2014 : 807693. ScholarBank@NUS Repository. https://doi.org/10.1155/2014/807693 23566140 https://scholarbank.nus.edu.sg/handle/10635/183711 Attribution 4.0 International http://creativecommons.org/licenses/by/4.0/ Unpaywall 20201031 |
| institution |
National University of Singapore |
| building |
NUS Library |
| continent |
Asia |
| country |
Singapore Singapore |
| content_provider |
NUS Library |
| collection |
ScholarBank@NUS |
| topic |
acceleration article general device packaging prediction reliability solder joint chemical model chemistry device failure analysis electronics heat materials testing scanning electron microscopy copper silver tin derivative Copper Electronics Equipment Failure Analysis Hot Temperature Materials Testing Microscopy, Electron, Scanning Models, Chemical Silver Tin Compounds |
| spellingShingle |
acceleration article general device packaging prediction reliability solder joint chemical model chemistry device failure analysis electronics heat materials testing scanning electron microscopy copper silver tin derivative Copper Electronics Equipment Failure Analysis Hot Temperature Materials Testing Microscopy, Electron, Scanning Models, Chemical Silver Tin Compounds Mi, J Li, Y.-F Yang, Y.-J Peng, W Huang, H.-Z Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-i censored data |
| description |
10.1155/2014/807693 |
| author2 |
INDUSTRIAL SYSTEMS ENGINEERING AND MANAGEMENT |
| author_facet |
INDUSTRIAL SYSTEMS ENGINEERING AND MANAGEMENT Mi, J Li, Y.-F Yang, Y.-J Peng, W Huang, H.-Z |
| format |
Article |
| author |
Mi, J Li, Y.-F Yang, Y.-J Peng, W Huang, H.-Z |
| author_sort |
Mi, J |
| title |
Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-i censored data |
| title_short |
Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-i censored data |
| title_full |
Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-i censored data |
| title_fullStr |
Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-i censored data |
| title_full_unstemmed |
Thermal cycling life prediction of Sn-3.0Ag-0.5Cu solder joint using type-i censored data |
| title_sort |
thermal cycling life prediction of sn-3.0ag-0.5cu solder joint using type-i censored data |
| publishDate |
2020 |
| url |
https://scholarbank.nus.edu.sg/handle/10635/183711 |
| _version_ |
1821214689568227328 |