Fracture of Sn-Ag-Cu solder joints on Cu substrates : I. effects of loading and processing conditions

• المؤلفون الرئيسيون: Pang, John Hock Lye, Huang, Z., Kumar, P., Dutta, I., Sidhu, R., Renavikar, M., Mahajan, R.
• مؤلفون آخرون: School of Mechanical and Aerospace Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2013
• الموضوعات: DRNTU::Engineering::Materials::Electronic packaging materials
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/96082; http://hdl.handle.net/10220/18099
• المؤسسة: Nanyang Technological University

During service, microcracks form inside solder joints, making microelectronic packages highly prone to failure on dropping. Hence, the fracture behavior of solder joints under drop conditions at high strain rates and under mixed-mode conditions is a critically important design consideration for robu...