Fracture of Sn-Ag-Cu solder joints on Cu substrates : I. effects of loading and processing conditions

• Main Authors: Pang, John Hock Lye, Huang, Z., Kumar, P., Dutta, I., Sidhu, R., Renavikar, M., Mahajan, R.
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2013
• Subjects: DRNTU::Engineering::Materials::Electronic packaging materials
• Online Access: https://hdl.handle.net/10356/96082; http://hdl.handle.net/10220/18099
• Institution: Nanyang Technological University

During service, microcracks form inside solder joints, making microelectronic packages highly prone to failure on dropping. Hence, the fracture behavior of solder joints under drop conditions at high strain rates and under mixed-mode conditions is a critically important design consideration for robu...