Effect of chain length on low temperature gold-gold bonding by self assembled monolayers

by Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.
Published 2012

In-situ monitoring of the thermal desorption of alkanethiols with surface plasmon resonance spectroscopy (SPRS)

by Wong, Chee Cheong, Romanato, Filippo, Lee, Kwang Hong, Ang, X. F., Li, J.
Published 2010

Critical temperatures in thermocompression gold stud bonding

by Zhang, G. G., Ang, X. F., Chen, Z., Wong, Chee C., Wei, J.
Published 2012

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

by Ang, X. F., Wei, J., Leong, K. C., Tan, Chuan Seng, Lim, Dau Fatt
Published 2013

Self-assembled monolayers for reduced temperature direct metal thermocompression bonding

by Ang, X. F., Li, F. Y., Tan, W. L., Chen, Z., Wong, Chee C., Wei, J.
Published 2012

Effect of copper TSV annealing on via protrusion for TSV wafer fabrication

by Heryanto, A., Putra, W. N., Trigg, Alastair David, Gao, S., Kwon, W. S., Che, Faxing, Ang, X. F., Wei, J., Made, Riko I., Gan, Chee Lip, Pey, Kin Leong
Published 2012