Homogeneous chip to wafer bonding of InP-Al2O3-Si using UV/O3 activation

بواسطة Tan, Chuan Seng, Anantha, P.
منشور في 2014

UV/O3 assisted InP/Al2O3–Al2O3/Si low temperature die to wafer bonding

بواسطة Anantha, P., Tan, Chuan Seng
منشور في 2015

Modeling, fabrication, and characterization of 3-D capacitor embedded in through-silicon via

بواسطة Lin, Ye, Tan, Chuan Seng
منشور في 2020

Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias

بواسطة Lin, Ye, Tan, Chuan Seng
منشور في 2020

Dielectric quality of 3D capacitor embedded in through-silicon via (TSV)

بواسطة Lin, Ye, Tan, Chuan Seng
منشور في 2020

Leakage current conduction mechanism in 3D capacitor embedded in Through-Silicon Via (TSV)

بواسطة Lin, Ye, Tan, Chuan Seng
منشور في 2020

Growth and characterization of germanium epitaxial film on silicon (001) using reduced pressure chemical vapor deposition

بواسطة Tan, Yew Heng, Tan, Chuan Seng
منشور في 2013

Three-dimensional modeling of near-field beam profiles from grating couplers using a deep neural network

بواسطة Lim, Yu Dian, Tan, Chuan Seng
منشور في 2024

Generation of beam profiles from chip-to-free-space coupling using deep neural network

بواسطة Lim, Yu Dian, Tan, Chuan Seng
منشور في 2025

Monolithic CMOS-MEMS integration for high-g accelerometers

بواسطة Narasimhan, Vinayak, Li, Holden, Tan, Chuan Seng
منشور في 2015

Lateral GeSn waveguide-based homojunction phototransistor for next-generation 2000nm communication and sensing applications

بواسطة Kumar, Harshvardhan, Chen, Qimiao, Tan, Chuan Seng
منشور في 2023

Theoretical insights into the amplified optical gain of hexagonal germanium by strain engineering

بواسطة Mayengbam, Rishikanta, Tan, Chuan Seng, Fan, Weijun
منشور في 2023

Integration of CNTs in 3D-IC interconnects: a non-destructive approach for the precise characterization and elucidation of interfacial properties

بواسطة Ghosh, K., Verma, Y. K., Tan, Chuan Seng
منشور في 2016

High-κ Al2O3 material in low temperature wafer-level bonding for 3D integration application

بواسطة Tan, Chuan Seng, Fan, J., Tu, L. C.
منشور في 2014

Electrical characteristics of three-dimensional metal-insulator-metal (3-D MIM) capacitor embedded in partially-filled Through-Silicon Via (TSV)

بواسطة Lin, Ye, Li, Hong Yu, Tan, Chuan Seng
منشور في 2020

Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface

بواسطة Made, Riko I., Gan, Chee Lip, Tan, Chuan Seng
منشور في 2012

The theoretical optical gain of Ge1−xSnx nanowires

بواسطة Xiong, Wen, Fan, Weijun, Song, Zhigang, Tan, Chuan Seng
منشور في 2020

Design of directional-emission GeSn multi-quantum-well light-emitting diodes on Si

بواسطة Chen, Qimiao, Mao, Weijie, Zhang, Lin, Tan, Chuan Seng
منشور في 2024

Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability

بواسطة Peng, L., Fan, Ji, Li, Kwok Hung, Tan, Chuan Seng
منشور في 2013

Low-power and high-detectivity Ge photodiodes by in-situ heavy As doping during Ge-on-Si seed layer growth

بواسطة Lin, Yiding, Lee, Kwang Hong, Son, Bongkwon, Tan, Chuan Seng
منشور في 2021