Ranking the efficiency performance within a set of decision making units by data envelopment analysis

by Li, Hong-Yu, Zhao, Hongxin, Zhu, Jishan
Published 2018

Robustly efficient parametric frontiers via multiplicative dea for domestic and international operations of the Latin American airline industry

by Charnes, Abraham, Gallegos, Armando, Li, Hong-Yu
Published 2018

Electrical characteristics of three-dimensional metal-insulator-metal (3-D MIM) capacitor embedded in partially-filled Through-Silicon Via (TSV)

by Lin, Ye, Li, Hong Yu, Tan, Chuan Seng
Published 2020

Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realization

by Tan, Chuan Seng, Lim, Dau Fatt, Peng, Lan, Li, Hong Yu
Published 2013

Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds

by Tan, Chuan Seng, Peng, Lan, Fan, Ji, Li, Hong Yu, Gao, Shan
Published 2013

Through silicon via fabrication with low-κ dielectric liner and its implications on parasitic capacitance and leakage current

by Zhang, Lin, Lim, Dau Fatt, Li, Hong Yu, Gao, Shan, Tan, Chuan Seng
Published 2013

Advanced 3D integration technologies in various quantum computing devices

by Zhao, Peng, Lim, Yu Dian, Li, Hong Yu, Guidoni, Luca, Tan, Chuan Seng
Published 2021

Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits

by Made, Riko I., Peng, Lan, Li, Hong Yu, Gan, Chee Lip, Tan, Chuan Seng
Published 2013

Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits

by Made, Riko I., Lan, Peng, Li, Hong Yu, Gan, Chee Lip, Tan, Chuan Seng
Published 2012

Design and fabrication of grating couplers for the optical addressing of trapped ions

by Lim, Yu Dian, Li, Hong Yu, Zhao, Peng, Tao, Jing, Guidoni, Luca, Tan, Chuan Seng
Published 2021

The integration of grounding plane into tsv integrated ion trap for efficient thermal management in large scale quantum computing device

by Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
Published 2023

Ceramic pin grid array with built-in interconnects to locate TSV integrated ion trap for wire bonding-free assembly

by Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Hu, Liangxing, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
Published 2023

Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects

by Shao, W., Chen, Z., Tu, K. N., Gusak, A. M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Li, Hong Yu
Published 2012

Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief

by Ghosh, Kaushik, Zhang, Jiye, Zhang, Lin, Dong, Yuanwei, Li, Hong Yu, Tan, Cher Ming, Xia, Guangrui, Tan, Chuan Seng
Published 2013

Surface-electrode ion trap with ground structures for minimizing the dielectric loss in the Si substrate

by Tao, Jing, Li, Hong Yu, Lim, Yu Dian, Zhao, Peng, Apriyana, Anak Agung Alit, Guidoni, Luca, Tan, Chuan Seng
Published 2021

Heating dissipation discussion of TSV-integrated ion trap with glass interposer

by Zhao, Peng, Bi, Xin Wen, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
Published 2024

CMOS-fabricated ring surface ion trap with TSV integration

by Zhao, Peng, Lim, Yu Dian, Li, Hong Yu, Likforman, Jean-Pierre, Guidoni, Luca, Desormeaux, Lilay Gros, Tan, Chuan Seng
Published 2024

Design and development of single-qubit ion trap on glass and Si substrates with RF analysis and performance benchmarking

by Apriyana, Anak Agung Alit, Li, Hong Yu, Zhao, Peng, Tao, Jing, Lim, Yu Dian, Lin, Ye, Guidoni, Luca, Tan, Chuan Seng
Published 2021

RF performance benchmarking of TSV integrated surface electrode ion trap for quantum computing

by Zhao, Peng, Li, Hong Yu, Tao, Jing, Likforman, Jean-Pierre, Lim, Yu Dian, Seit, Wen Wei, Luca, Guidoni, Tan, Chuan Seng
Published 2021

TSV-integrated surface electrode ion trap for scalable quantum information processing

by Zhao, Peng, Likforman, J. P., Li, Hong Yu, Tao, Jing, Henner, T., Lim, Yu Dian, Seit, W. W., Tan, Chuan Seng, Guidoni, Luca
Published 2021