Advanced 3D integration technologies in various quantum computing devices

As a key approach to augment Moore’s Law scaling, 3D integration technologies have enabled small form factor, low cost, diverse, modular and flexible assembly of integrated circuits in the semiconductor industry. It is therefore essential to adopt these technologies to the quantum computing device...

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Bibliographic Details
Main Authors: Zhao, Peng, Lim, Yu Dian, Li, Hong Yu, Guidoni, Luca, Tan, Chuan Seng
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2021
Subjects:
Online Access:https://hdl.handle.net/10356/153118
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Institution: Nanyang Technological University
Language: English