Advanced 3D integration technologies in various quantum computing devices

• Main Authors: Zhao, Peng, Lim, Yu Dian, Li, Hong Yu, Guidoni, Luca, Tan, Chuan Seng
• Other Authors: School of Electrical and Electronic Engineering
• Format: Article
• Language: English
• Published: 2021
• Subjects: Engineering::Electrical and electronic engineering; Qubit; Quantum Computing
• Online Access: https://hdl.handle.net/10356/153118
• Institution: Nanyang Technological University

As a key approach to augment Moore’s Law scaling, 3D integration technologies have enabled small form factor, low cost, diverse, modular and flexible assembly of integrated circuits in the semiconductor industry. It is therefore essential to adopt these technologies to the quantum computing device...