Fracture toughness measurement of thin films on compliant substrate using controlled buckling test

由 Chen, Zhong, Gan, Zhenghao
出版 2012

Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

由 Tan, Cher Ming, Gan, Zhenghao
出版 2009

Nondestructive void size determination in copper metallization under passivation

由 Gan, Zhenghao, Tan, Cher Ming, Zhang, Guan
出版 2009

Dynamic study of the physical processes in the intrinsic line electromigration of deep-submicron copper and aluminum interconnects

由 Tan, Cher Ming, Zhang, Guan, Gan, Zhenghao
出版 2009

Temperature and stress distribution in the SOI structure during fabrication

由 Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang
出版 2009

Applications of finite element methods for reliability study of ULSI interconnections

由 Tan, Cher Ming, Li, Wei, Gan, Zhenghao
出版 2013

Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test

由 Prasad, K., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Chen, Zhong, Zhang, Sam, Chen, Zhe
出版 2012

Analytical modeling of reservoir effect on electromigration in Cu interconnects

由 Zaporozhets, T., Tu, K. N., Gusak, A. M., Shao, W., Gan, Zhenghao, Chen, Zhong, Mhaisalkar, Subodh Gautam
出版 2012

Modification of Ta/polymeric low-k interface by electron beam treatment

由 Prasad, K., Damayanti, M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Chen, Zhong, Chen, Zhe, Zhang, Sam, Jiang, Ning
出版 2012

Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface

由 Damayanti, M., Prasad, K., Chen, Zhe, Zhang, Sam, Jiang, Ning, Gan, Zhenghao, Chen, Zhong, Mhaisalkar, Subodh Gautam
出版 2012

Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects

由 Shao, W., Chen, Z., Tu, K. N., Gusak, A. M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Li, Hong Yu
出版 2012