Fracture toughness measurement of thin films on compliant substrate using controlled buckling test

by Chen, Zhong, Gan, Zhenghao
Published 2012

Failure mechanisms of aluminum bondpad peeling during thermosonic bonding

by Tan, Cher Ming, Gan, Zhenghao
Published 2009

Nondestructive void size determination in copper metallization under passivation

by Gan, Zhenghao, Tan, Cher Ming, Zhang, Guan
Published 2009

Dynamic study of the physical processes in the intrinsic line electromigration of deep-submicron copper and aluminum interconnects

by Tan, Cher Ming, Zhang, Guan, Gan, Zhenghao
Published 2009

Temperature and stress distribution in the SOI structure during fabrication

by Tan, Cher Ming, Gan, Zhenghao, Gao, Xiaofang
Published 2009

Applications of finite element methods for reliability study of ULSI interconnections

by Tan, Cher Ming, Li, Wei, Gan, Zhenghao
Published 2013

Study of interfacial adhesion energy of multilayered ULSI thin film structures using four-point bending test

by Prasad, K., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Chen, Zhong, Zhang, Sam, Chen, Zhe
Published 2012

Analytical modeling of reservoir effect on electromigration in Cu interconnects

by Zaporozhets, T., Tu, K. N., Gusak, A. M., Shao, W., Gan, Zhenghao, Chen, Zhong, Mhaisalkar, Subodh Gautam
Published 2012

Modification of Ta/polymeric low-k interface by electron beam treatment

by Prasad, K., Damayanti, M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Chen, Zhong, Chen, Zhe, Zhang, Sam, Jiang, Ning
Published 2012

Effect of electron beam treatment on adhesion of Ta/polymeric low-k interface

by Damayanti, M., Prasad, K., Chen, Zhe, Zhang, Sam, Jiang, Ning, Gan, Zhenghao, Chen, Zhong, Mhaisalkar, Subodh Gautam
Published 2012

Reservoir effect and the role of low current density regions on electromigration lifetimes in copper interconnects

by Shao, W., Chen, Z., Tu, K. N., Gusak, A. M., Gan, Zhenghao, Mhaisalkar, Subodh Gautam, Li, Hong Yu
Published 2012