Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief
Through silicon via (TSV) consists of a copper (Cu) core isolated by a dielectric liner. The thermomechanical stress originating from the mismatch in the coefficient of thermal expansion of Cu and silicon is a serious concern on mechanical reliability and electrical variability. The effect on thermo...
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Main Authors: | , , , , , , , |
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Other Authors: | |
Format: | Article |
Language: | English |
Published: |
2013
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Subjects: | |
Online Access: | https://hdl.handle.net/10356/99278 http://hdl.handle.net/10220/12600 |
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Institution: | Nanyang Technological University |
Language: | English |