Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay

by Zhang, J., Zhang, L., Dong, Y., Li, H. Y., Ghosh, Kaushik, Tan, Cher Ming, Xia, Guangrui, Tan, Chuan Seng
Published 2013

Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief

by Ghosh, Kaushik, Zhang, Jiye, Zhang, Lin, Dong, Yuanwei, Li, Hong Yu, Tan, Cher Ming, Xia, Guangrui, Tan, Chuan Seng
Published 2013