The integration of grounding plane into tsv integrated ion trap for efficient thermal management in large scale quantum computing device

by Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
Published 2023

Ceramic pin grid array with built-in interconnects to locate TSV integrated ion trap for wire bonding-free assembly

by Zhao, Peng, Li, Hong Yu, Lim, Yu Dian, Hu, Liangxing, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
Published 2023

Heating dissipation discussion of TSV-integrated ion trap with glass interposer

by Zhao, Peng, Bi, Xin Wen, Li, Hong Yu, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
Published 2024

Development of nitride-based optical phased array at 1092 nm for the optical addressing of ⁸⁸Sr+ Ion

by Lim, Yu Dian, Goh, Simon Chun Kiat, Seit, Wen Wei, Zhao, Peng, Guidoni, Luca, Likforman, Jean-Pierre, Tan, Chuan Seng
Published 2023

RF performance benchmarking of TSV integrated surface electrode ion trap for quantum computing

by Zhao, Peng, Li, Hong Yu, Tao, Jing, Likforman, Jean-Pierre, Lim, Yu Dian, Seit, Wen Wei, Luca, Guidoni, Tan, Chuan Seng
Published 2021

Large-scale fabrication of surface ion traps on a 300 mm glass wafer

by Tao, Jing, Likforman, Jean-Pierre, Zhao, Peng, Li, Hong Yu, Henner, Theo, Lim, Yu Dian, Seit, Wen Wei, Guidoni, Luca, Tan, Chuan Seng
Published 2022

Simplified Assembly of Through-Silicon-Via Integrated Ion Traps

by Zhao, Peng, Li, Hong Yu, Likforman, Jean-Pierre, Henner, Theo, Lim, Yu Dian, Hu, Liang Xing, Seit, Wen Wei, Luca, Guidoni, Tan, Chuan Seng
Published 2023