Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface

by Made, Riko I., Gan, Chee Lip, Tan, Chuan Seng
Published 2012

Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits

by Made, Riko I., Peng, Lan, Li, Hong Yu, Gan, Chee Lip, Tan, Chuan Seng
Published 2013

Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits

by Made, Riko I., Lan, Peng, Li, Hong Yu, Gan, Chee Lip, Tan, Chuan Seng
Published 2012

Improved reliability of AlGaN/GaN-on-Si high electron mobility transistors (HEMTs) with high density silicon nitride passivation

by Sasangka, W. A., Syaranamual, G. J., Gao, Yu, Made, Riko I, Gan, Chee Lip, Thompson, C. V.
Published 2017

Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects

by Made, Riko I., Thompson, Carl V., Leong, H. L., Li, H. Y., Gan, Chee Lip, Pey, Kin Leong
Published 2012

Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

by Lau, John H., Made, Riko I., Gan, Chee Lip, Yan, Li Ling, Yu, Aibin, Yoon, Seung Wook, Lee, Chengkuo
Published 2011

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

by Yan, Li Ling, Gan, Chee Lip, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong, Made, Riko I., Thompson, Carl V.
Published 2013

Experimental characterization and modeling of the mechanical properties of Cu–Cu thermocompression bonds for three-dimensional integrated circuits

by Made, Riko I., Thompson, Carl V., Gan, Chee Lip, Yan, Li Ling, Kor, Katherine Hwee Boon, Chia, Hong Ling, Pey, Kin Leong
Published 2012

Improved mechanical and thermomechanical properties of alumina substrate via iron doping

by Made, Riko I., Phua, Eric Jian Rong, Pramana, Stevin Snellius, Wong, Chee Cheong, Chen, Zhong, Gan, Chee Lip, Tok, Alfred Iing Yoong
Published 2013

Noble metal alloy thin films by atomic layer deposition and rapid Joule heating

by Guo, Yuanyuan, Zou, Yiming, Cheng, Chunyu, Wang, Leyan, Made, Riko I., Goei, Ronn, Tan, Kwan Wee, Li, Shuzhou, Tok, Alfred Iing Yoong
Published 2022

Effect of copper TSV annealing on via protrusion for TSV wafer fabrication

by Heryanto, A., Putra, W. N., Trigg, Alastair David, Gao, S., Kwon, W. S., Che, Faxing, Ang, X. F., Wei, J., Made, Riko I., Gan, Chee Lip, Pey, Kin Leong
Published 2012

Characterisation of defects generated during constant current InGaN-on-silicon LED operation

by Made, Riko I, Gao, Yu, Syaranamual, G. J., Sasangka, W. A., Zhang, Li, Nguyen, Xuan Sang, Tay, Yee Yan, Herrin, Jason Scott, Thompson, C. V., Gan, Chee Lip
Published 2017

Study of metal additives to alumina ceramics substrate for high temperature and pressure application

by Made, Riko I., Phua, Eric Jian Rong, Sharif, Ahmed, Pramana, Stevin Snellius, Wong, Chee Cheong, Chen, Zhong, Nachiappan, Vivek Chidambaram, Ho, Beng Yeung, Gao, Shan, Tok, Alfred Iing Yoong
Published 2013

The integration of InGaP LEDs with CMOS on 200 mm silicon wafers

by Wang, Bing, Lee, Kwang Hong, Wang, Cong, Wang, Yue, Made, Riko I., Sasangka, Wardhana Aji, Nguyen, Viet Cuong, Lee, Kenneth Eng Kian, Tan, Chuan Seng, Yoon, Soon Fatt, Fitzgerald, Eugene A., Michel, Jurgen
Published 2019

An object-oriented framework to enable workflow evolution across materials acceleration platforms

by Leong, Chang Jie, Low, Andre Kai Yuan, Recatala-Gomez, Jose, Velasco, Pablo Quijano, Vissol-Gaudin, Eleonore, Tan, Jin Da, Ramalingam, Balamurugan, Made, Riko I, Pethe, Shreyas Dinesh, Sebastian, Saumya, Lim, Yee-Fun, Khoo, Jonathan Zi Hui, Bai, Yang, Cheng, Jayce Jian Wei, Hippalgaonkar, Kedar
Published 2023