Characterization of Cu-Sn-In thin films for three-dimensional heterogeneous system integration

by Sasangka, Wardhana Aji
Published 2014

Monolithic integration of Si-CMOS and III-V-on-Si through direct wafer bonding process

by Lee, Kwang Hong, Wang, Yue, Wang, Bing, Zhang, Li, Sasangka, Wardhana Aji, Goh, Shuh Chin, Bao, Shuyu, Lee, Kenneth E., Fitzgerald, Eugene A., Tan, Chuan Seng
Published 2018

Joining copper oxide nanotube arrays driven by the nanoscale Kirkendall effect

by Chun, Shu Rong, Sasangka, Wardhana Aji, Ng, Mei Zhen, Liu, Qing, Du, Anyan, Zhu, Jie, Ng, Chee Mang, Liu, Zhi Qiang, Chiam, Sing Yang, Gan, Chee Lip
Published 2014

The integration of InGaP LEDs with CMOS on 200 mm silicon wafers

by Wang, Bing, Lee, Kwang Hong, Wang, Cong, Wang, Yue, Made, Riko I., Sasangka, Wardhana Aji, Nguyen, Viet Cuong, Lee, Kenneth Eng Kian, Tan, Chuan Seng, Yoon, Soon Fatt, Fitzgerald, Eugene A., Michel, Jurgen
Published 2019

Iron-facilitated dynamic active-site generation on spinel CoAl₂O₄ with self-termination of surface reconstruction for water oxidation

by Wu, Tianze, Sun, Shengnan, Song, Jiajia, Xi, Shibo, Du, Yonghua, Chen, Bo, Sasangka, Wardhana Aji, Liao, Hanbin, Gan, Chee Lip, Scherer, Günther G., Zeng, Lin, Wang, Haijiang, Li, Hui, Grimaud, Alexis, Xu, Zhichuan Jason
Published 2021