Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects

• Main Authors: Made, Riko I., Thompson, Carl V., Leong, H. L., Li, H. Y., Gan, Chee Lip, Pey, Kin Leong
• Other Authors: School of Materials Science & Engineering
• Format: Article
• Language: English
• Published: 2012
• Subjects: DRNTU::Engineering::Materials::Material testing and characterization
• Online Access: https://hdl.handle.net/10356/79638; http://hdl.handle.net/10220/8163
• Institution: Nanyang Technological University

The effects of the surface roughness and applied loads on the specific electrical contact resistance of three-dimensional Cu–Cu bonded interconnects have been quantitatively investigated. Wafer-level thermocompression bonding was carried out on bonded Cu layers with either different surface roughnes...