Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects

• المؤلفون الرئيسيون: Made, Riko I., Thompson, Carl V., Leong, H. L., Li, H. Y., Gan, Chee Lip, Pey, Kin Leong
• مؤلفون آخرون: School of Materials Science & Engineering
• التنسيق: مقال
• اللغة: English
• منشور في: 2012
• الموضوعات: DRNTU::Engineering::Materials::Material testing and characterization
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/79638; http://hdl.handle.net/10220/8163
• المؤسسة: Nanyang Technological University

The effects of the surface roughness and applied loads on the specific electrical contact resistance of three-dimensional Cu–Cu bonded interconnects have been quantitatively investigated. Wafer-level thermocompression bonding was carried out on bonded Cu layers with either different surface roughnes...