Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability

by Peng, L., Fan, Ji, Li, Kwok Hung, Tan, Chuan Seng
Published 2013

Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stacking

by Peng, L., Li, H. Y., Fan, Ji, Gao, Shan, Tan, Chuan Seng
Published 2013

Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds

by Tan, Chuan Seng, Peng, Lan, Fan, Ji, Li, Hong Yu, Gao, Shan
Published 2013

Cu–Cu hermetic seal enhancement using self-assembled monolayer passivation

by Peng, L., Leong, K. C., Lim, Dau Fatt, Fan, Ji, Tan, Chuan Seng
Published 2013

Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking

by Peng, L., Zhang, L., Li, H. Y., Fan, Ji, Lim, Dau Fatt, Tan, Chuan Seng
Published 2013