RF characterization and design of multi-TSV with embedded capacitor

by Panwar, Neeraj, Apriyana, Anak Agung Alit, Lin, Ye, Tan, Chuan Seng
Published 2020

Three-dimensional capacitor embedded in fully Cu-filled through-silicon via and its thermo-mechanical reliability for power delivery applications

by Lin, Ye, Apriyana, Anak Agung Alit, Hong, Yu Li, Tan, Chuan Seng
Published 2020

Surface-electrode ion trap with ground structures for minimizing the dielectric loss in the Si substrate

by Tao, Jing, Li, Hong Yu, Lim, Yu Dian, Zhao, Peng, Apriyana, Anak Agung Alit, Guidoni, Luca, Tan, Chuan Seng
Published 2021

Design and development of single-qubit ion trap on glass and Si substrates with RF analysis and performance benchmarking

by Apriyana, Anak Agung Alit, Li, Hong Yu, Zhao, Peng, Tao, Jing, Lim, Yu Dian, Lin, Ye, Guidoni, Luca, Tan, Chuan Seng
Published 2021