Three-dimensional capacitor embedded in fully Cu-filled through-silicon via and its thermo-mechanical reliability for power delivery applications

• Main Authors: Lin, Ye, Apriyana, Anak Agung Alit, Hong, Yu Li, Tan, Chuan Seng
• Other Authors: School of Electrical and Electronic Engineering
• Format: Conference or Workshop Item
• Language: English
• Published: 2020
• Subjects: Engineering::Electrical and electronic engineering::Semiconductors; Through-silicon Vias; MIM Capacitors
• Online Access: https://hdl.handle.net/10356/144083
• Institution: Nanyang Technological University

This paper demonstrates the successful integration of three-dimensional (3-D) metal-insulator-metal (MIM) capacitors embedded in fully-filled Cu TSVs with diameter of 10 and 20 μm. Their thermo-mechanical reliability has been studied with both physical characterizations and electrical characterizati...