Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias

• Main Authors: Lin, Ye, Tan, Chuan Seng
• 其他作者: School of Electrical and Electronic Engineering
• 格式: Article
• 語言: English
• 出版: 2020
• 主題: Engineering::Electrical and electronic engineering; MIM Capacitor; ALD Samples
• 在線閱讀: https://hdl.handle.net/10356/142599
• 機構: Nanyang Technological University

Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias has been investigated for two sets of test vehicles, namely "sputtering samples" and "atomic layer deposition (ALD) samples". Schottky emission, hopping conduction, Poole-Frenkel...