Design, fabrication, and characterization of three-dimensional embedded capacitor in through-silicon via

by Lin, Ye
Published 2019

Modeling, fabrication, and characterization of 3-D capacitor embedded in through-silicon via

by Lin, Ye, Tan, Chuan Seng
Published 2020

Leakage current conduction mechanism of three-dimensional capacitors embedded in through-silicon vias

by Lin, Ye, Tan, Chuan Seng
Published 2020

Dielectric quality of 3D capacitor embedded in through-silicon via (TSV)

by Lin, Ye, Tan, Chuan Seng
Published 2020

Leakage current conduction mechanism in 3D capacitor embedded in Through-Silicon Via (TSV)

by Lin, Ye, Tan, Chuan Seng
Published 2020

The Impact of Fiscal Decentralization on Urban Agglomeration: Evidence from China

by Alfred M. Wu, Lin Ye, Li Hui
Published 2018

Electrical characteristics of three-dimensional metal-insulator-metal (3-D MIM) capacitor embedded in partially-filled Through-Silicon Via (TSV)

by Lin, Ye, Li, Hong Yu, Tan, Chuan Seng
Published 2020

Analysis of tanker freight market and forecasting of future market movement

by Bao, Lin Ye, Xu, Peng, Zhang, You Wen
Published 2008

RF characterization and design of multi-TSV with embedded capacitor

by Panwar, Neeraj, Apriyana, Anak Agung Alit, Lin, Ye, Tan, Chuan Seng
Published 2020

Three-dimensional capacitor embedded in fully Cu-filled through-silicon via and its thermo-mechanical reliability for power delivery applications

by Lin, Ye, Apriyana, Anak Agung Alit, Hong, Yu Li, Tan, Chuan Seng
Published 2020

Design and development of single-qubit ion trap on glass and Si substrates with RF analysis and performance benchmarking

by Apriyana, Anak Agung Alit, Li, Hong Yu, Zhao, Peng, Tao, Jing, Lim, Yu Dian, Lin, Ye, Guidoni, Luca, Tan, Chuan Seng
Published 2021