Growth and fabrication of carbon-based three-dimensional heterostructure in through-silicon vias (TSVs) for 3D interconnects

• المؤلفون الرئيسيون: Zhu, Ye, Tan, Chong Wei, Chua, Shen Lin, Lim, Yu Dian, Tay, Beng Kang, Tan, Chuan Seng
• مؤلفون آخرون: School of Electrical and Electronic Engineering
• التنسيق: Conference or Workshop Item
• اللغة: English
• منشور في: 2021
• الموضوعات: Engineering::Electrical and electronic engineering; Carbon Nanomaterials; Through-Silicon Vias
• الوصول للمادة أونلاين: https://hdl.handle.net/10356/151178
• المؤسسة: Nanyang Technological University

Carbon nanomaterials such as graphene and carbon nanotubes (CNTs) have recently received much attention as potential materials proposed for integration in the future semiconductor technologies because of the advantageous properties particularly in thermal and electrical conductivities. Among them, t...