Pulse electroplating of copper film : a study of process and microstructure

Copper films with high density of twin boundaries are known for high mechanical strength with little tradeoff in electrical conductivity. To achieve such a high density, twin lamellae and spacing will be on the nanoscale. In the current study, 10 microm copper films were prepared by pulse electrodep...

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Bibliographic Details
Main Authors: Zhang, X., Tu, K. N., Chen, Z., Tan, Y. K., Wong, Chee C., Mhaisalkar, Subodh Gautam, Li, X. M., Tung, Chih Hang, Cheng, C. K.
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2012
Online Access:https://hdl.handle.net/10356/94840
http://hdl.handle.net/10220/8115
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Institution: Nanyang Technological University
Language: English