Pulse electroplating of copper film : a study of process and microstructure
Copper films with high density of twin boundaries are known for high mechanical strength with little tradeoff in electrical conductivity. To achieve such a high density, twin lamellae and spacing will be on the nanoscale. In the current study, 10 microm copper films were prepared by pulse electrodep...
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| Main Authors: | , , , , , , , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2012
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| Online Access: | https://hdl.handle.net/10356/94840 http://hdl.handle.net/10220/8115 |
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| Institution: | Nanyang Technological University |
| Language: | English |