Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field

Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field

10.1109/TMAG.2007.893416

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Bibliographic Details
Main Authors: Yi, J.B., Li, X.P., Ding, J., Yin, J.H., Thongmee, S., Seet, H.L.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Applied field
Composite wire
Electrodeposition
Magnetoimpedence (MI)
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86024
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/86024

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