Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field
10.1109/TMAG.2007.893416
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Main Authors: | Yi, J.B., Li, X.P., Ding, J., Yin, J.H., Thongmee, S., Seet, H.L. |
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Other Authors: | MECHANICAL ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/86024 |
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Institution: | National University of Singapore |
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