Intermittent deposition and interface formation on the microstructure and magnetic properties of NiFe/Cu composite wires

Intermittent deposition and interface formation on the microstructure and magnetic properties of NiFe/Cu composite wires

10.1016/j.physb.2008.03.017

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Bibliographic Details
Main Authors: Jiang, L., Tan, L.S., Ruan, J.Z., Yuan, W.Z., Li, X.P., Zhao, Z.J.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Anisotropy field
Composite wires
GMI effect
Grain size
Interface
Online Access:http://scholarbank.nus.edu.sg/handle/10635/50957
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/50957

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