Intermittent deposition and interface formation on the microstructure and magnetic properties of NiFe/Cu composite wires

Intermittent deposition and interface formation on the microstructure and magnetic properties of NiFe/Cu composite wires

10.1016/j.physb.2008.03.017

Saved in:
Bibliographic Details
Main Authors: Jiang, L., Tan, L.S., Ruan, J.Z., Yuan, W.Z., Li, X.P., Zhao, Z.J.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Anisotropy field
Composite wires
GMI effect
Grain size
Interface
Online Access:http://scholarbank.nus.edu.sg/handle/10635/50957
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Similar Items

Similar Items