Magnetically Controlled Electroplating of NiFe/Cu Composite Wires

Magnetically Controlled Electroplating of NiFe/Cu Composite Wires

10.1149/1.1625593

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Bibliographic Details
Main Authors: Li, X.P., Zhao, Z.J., Seet, H.L., Heng, W.M., Oh, T.B., Lee, J.Y.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/89354
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/89354

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