Magnetically Controlled Electroplating of NiFe/Cu Composite Wires
10.1149/1.1625593
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Main Authors: | Li, X.P., Zhao, Z.J., Seet, H.L., Heng, W.M., Oh, T.B., Lee, J.Y. |
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Other Authors: | CHEMICAL & BIOMOLECULAR ENGINEERING |
Format: | Article |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/89354 |
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Institution: | National University of Singapore |
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