Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field

10.1109/TMAG.2007.893416

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Main Authors: Yi, J.B., Li, X.P., Ding, J., Yin, J.H., Thongmee, S., Seet, H.L.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86024
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-860242024-11-14T20:43:24Z Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field Yi, J.B. Li, X.P. Ding, J. Yin, J.H. Thongmee, S. Seet, H.L. MECHANICAL ENGINEERING MATERIALS SCIENCE AND ENGINEERING Applied field Composite wire Electrodeposition Magnetoimpedence (MI) 10.1109/TMAG.2007.893416 IEEE Transactions on Magnetics 43 6 2980-2982 IEMGA 2014-10-07T09:15:00Z 2014-10-07T09:15:00Z 2007-06 Conference Paper Yi, J.B., Li, X.P., Ding, J., Yin, J.H., Thongmee, S., Seet, H.L. (2007-06). Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field. IEEE Transactions on Magnetics 43 (6) : 2980-2982. ScholarBank@NUS Repository. https://doi.org/10.1109/TMAG.2007.893416 00189464 http://scholarbank.nus.edu.sg/handle/10635/86024 000246706200296 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Applied field
Composite wire
Electrodeposition
Magnetoimpedence (MI)
spellingShingle Applied field
Composite wire
Electrodeposition
Magnetoimpedence (MI)
Yi, J.B.
Li, X.P.
Ding, J.
Yin, J.H.
Thongmee, S.
Seet, H.L.
Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field
description 10.1109/TMAG.2007.893416
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Yi, J.B.
Li, X.P.
Ding, J.
Yin, J.H.
Thongmee, S.
Seet, H.L.
format Conference or Workshop Item
author Yi, J.B.
Li, X.P.
Ding, J.
Yin, J.H.
Thongmee, S.
Seet, H.L.
author_sort Yi, J.B.
title Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field
title_short Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field
title_full Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field
title_fullStr Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field
title_full_unstemmed Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field
title_sort microstructure evolution of ni80fe20-cu deposited by electroplating under an applied field
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/86024
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