Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field
10.1109/TMAG.2007.893416
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2014
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sg-nus-scholar.10635-860242024-11-14T20:43:24Z Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field Yi, J.B. Li, X.P. Ding, J. Yin, J.H. Thongmee, S. Seet, H.L. MECHANICAL ENGINEERING MATERIALS SCIENCE AND ENGINEERING Applied field Composite wire Electrodeposition Magnetoimpedence (MI) 10.1109/TMAG.2007.893416 IEEE Transactions on Magnetics 43 6 2980-2982 IEMGA 2014-10-07T09:15:00Z 2014-10-07T09:15:00Z 2007-06 Conference Paper Yi, J.B., Li, X.P., Ding, J., Yin, J.H., Thongmee, S., Seet, H.L. (2007-06). Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field. IEEE Transactions on Magnetics 43 (6) : 2980-2982. ScholarBank@NUS Repository. https://doi.org/10.1109/TMAG.2007.893416 00189464 http://scholarbank.nus.edu.sg/handle/10635/86024 000246706200296 Scopus |
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Applied field Composite wire Electrodeposition Magnetoimpedence (MI) |
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Applied field Composite wire Electrodeposition Magnetoimpedence (MI) Yi, J.B. Li, X.P. Ding, J. Yin, J.H. Thongmee, S. Seet, H.L. Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field |
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10.1109/TMAG.2007.893416 |
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MECHANICAL ENGINEERING |
author_facet |
MECHANICAL ENGINEERING Yi, J.B. Li, X.P. Ding, J. Yin, J.H. Thongmee, S. Seet, H.L. |
format |
Conference or Workshop Item |
author |
Yi, J.B. Li, X.P. Ding, J. Yin, J.H. Thongmee, S. Seet, H.L. |
author_sort |
Yi, J.B. |
title |
Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field |
title_short |
Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field |
title_full |
Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field |
title_fullStr |
Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field |
title_full_unstemmed |
Microstructure evolution of Ni80Fe20-Cu deposited by electroplating under an applied field |
title_sort |
microstructure evolution of ni80fe20-cu deposited by electroplating under an applied field |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/86024 |
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1821183863115743232 |