Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times

• Main Authors: Yan, Guangxu, Gill, Vincent, Gan, Chee Lip, Chen, Zhong
• 其他作者: School of Materials Science and Engineering
• 格式: Article
• 語言: English
• 出版: 2023
• 主題: Engineering::Materials; Microstructure; Mechanical Properties
• 在線閱讀: https://hdl.handle.net/10356/164395

Much attention has been drawn to the Ni-Sn transient liquid phase (TLP) bonded joints for high-temperature electronic packaging applications since their inception. A comparative study of Ni-Sn TLP bonded joints with different interlayers was conducted. The evolution of microstructure and mechanical...