Microstructure and mechanical properties of electroplated Ni-Sn TLP bonded joints with different bonding and aging times

• Main Authors: Yan, Guangxu, Gill, Vincent, Gan, Chee Lip, Chen, Zhong
• Other Authors: School of Materials Science and Engineering
• Format: Article
• Language: English
• Published: 2023
• Subjects: Engineering::Materials; Microstructure; Mechanical Properties
• Online Access: https://hdl.handle.net/10356/164395
• Institution: Nanyang Technological University

Much attention has been drawn to the Ni-Sn transient liquid phase (TLP) bonded joints for high-temperature electronic packaging applications since their inception. A comparative study of Ni-Sn TLP bonded joints with different interlayers was conducted. The evolution of microstructure and mechanical...