The study of Ni-Sn transient liquid phase bonded joints under high temperatures

The study of Ni-Sn transient liquid phase bonded joints under high temperatures

To develop new electronic packaging techniques for harsh environments, the microstructure and associated mechanical properties of Ni-Sn transient liquid phase (TLP) bonded joints at high temperatures have been investigated in this work. The effect of bonding temperature (from 400 °C to 700 °C) on th...

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Bibliographic Details
Main Authors: Yan, Guangxu, Bhowmik, Ayan, Gill, Vincent, Gan, Chee Lip, Chen, Zhong
Other Authors: School of Materials Science and Engineering
Format: Article
Language:English
Published: 2023
Subjects:
Engineering::Materials
Microstructure Evolution
Thermal Reliability
Online Access:https://hdl.handle.net/10356/170909
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Institution: Nanyang Technological University
Language: English

Internet

https://hdl.handle.net/10356/170909

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