Pulse electroplating of copper film : a study of process and microstructure

• Main Authors: Zhang, X., Tu, K. N., Chen, Z., Tan, Y. K., Wong, Chee C., Mhaisalkar, Subodh Gautam, Li, X. M., Tung, Chih Hang, Cheng, C. K.
• Other Authors: School of Mechanical and Aerospace Engineering
• Format: Article
• Language: English
• Published: 2012
• Online Access: https://hdl.handle.net/10356/94840; http://hdl.handle.net/10220/8115
• Institution: Nanyang Technological University

Copper films with high density of twin boundaries are known for high mechanical strength with little tradeoff in electrical conductivity. To achieve such a high density, twin lamellae and spacing will be on the nanoscale. In the current study, 10 microm copper films were prepared by pulse electrodep...