Pulse electroplating of copper film : a study of process and microstructure

Copper films with high density of twin boundaries are known for high mechanical strength with little tradeoff in electrical conductivity. To achieve such a high density, twin lamellae and spacing will be on the nanoscale. In the current study, 10 microm copper films were prepared by pulse electrodep...

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Main Authors: Zhang, X., Tu, K. N., Chen, Z., Tan, Y. K., Wong, Chee C., Mhaisalkar, Subodh Gautam, Li, X. M., Tung, Chih Hang, Cheng, C. K.
Other Authors: School of Mechanical and Aerospace Engineering
Format: Article
Language:English
Published: 2012
Online Access:https://hdl.handle.net/10356/94840
http://hdl.handle.net/10220/8115
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Institution: Nanyang Technological University
Language: English
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spelling sg-ntu-dr.10356-948402020-03-07T12:01:28Z Pulse electroplating of copper film : a study of process and microstructure Zhang, X. Tu, K. N. Chen, Z. Tan, Y. K. Wong, Chee C. Mhaisalkar, Subodh Gautam Li, X. M. Tung, Chih Hang Cheng, C. K. School of Mechanical and Aerospace Engineering Copper films with high density of twin boundaries are known for high mechanical strength with little tradeoff in electrical conductivity. To achieve such a high density, twin lamellae and spacing will be on the nanoscale. In the current study, 10 microm copper films were prepared by pulse electrodeposition with different applied pulse peak current densities and pulse on-times. It was found that the deposits microstructure was dependent on the parameters of pulse plating. Higher energy pulses caused stronger self-annealing effect on grain recrystallization and growth, thus leading to enhanced fiber textures, while lower energy pulses gave rise to more random microstructure in the deposits and rougher surface topography. However in the extremes of pulse currents we applied, the twin densities were not as high as those resulted from the medium or relatively high pulse currents. The highest amount of nanoscale twinning was found to form from a proper degree of self-annealing induced grain structure evolution. The driving force behind the self-annealing is discussed. 2012-05-22T08:19:00Z 2019-12-06T19:03:09Z 2012-05-22T08:19:00Z 2019-12-06T19:03:09Z 2008 2008 Journal Article Zhang, X., Tu, K. N., Chen, Z., Tan, Y. K., Wong, C. C., Mhaisalkar, S. G.,et al. (2008). Pulse electroplating of copper film : a study of process and microstructure. Journal of nanoscience and nanotechnology, 8 (5), 2568-2574 https://hdl.handle.net/10356/94840 http://hdl.handle.net/10220/8115 10.1166/jnn.2008.452 en Journal of nanoscience and nanotechnology © 2008 American Scientific Publishers
institution Nanyang Technological University
building NTU Library
country Singapore
collection DR-NTU
language English
description Copper films with high density of twin boundaries are known for high mechanical strength with little tradeoff in electrical conductivity. To achieve such a high density, twin lamellae and spacing will be on the nanoscale. In the current study, 10 microm copper films were prepared by pulse electrodeposition with different applied pulse peak current densities and pulse on-times. It was found that the deposits microstructure was dependent on the parameters of pulse plating. Higher energy pulses caused stronger self-annealing effect on grain recrystallization and growth, thus leading to enhanced fiber textures, while lower energy pulses gave rise to more random microstructure in the deposits and rougher surface topography. However in the extremes of pulse currents we applied, the twin densities were not as high as those resulted from the medium or relatively high pulse currents. The highest amount of nanoscale twinning was found to form from a proper degree of self-annealing induced grain structure evolution. The driving force behind the self-annealing is discussed.
author2 School of Mechanical and Aerospace Engineering
author_facet School of Mechanical and Aerospace Engineering
Zhang, X.
Tu, K. N.
Chen, Z.
Tan, Y. K.
Wong, Chee C.
Mhaisalkar, Subodh Gautam
Li, X. M.
Tung, Chih Hang
Cheng, C. K.
format Article
author Zhang, X.
Tu, K. N.
Chen, Z.
Tan, Y. K.
Wong, Chee C.
Mhaisalkar, Subodh Gautam
Li, X. M.
Tung, Chih Hang
Cheng, C. K.
spellingShingle Zhang, X.
Tu, K. N.
Chen, Z.
Tan, Y. K.
Wong, Chee C.
Mhaisalkar, Subodh Gautam
Li, X. M.
Tung, Chih Hang
Cheng, C. K.
Pulse electroplating of copper film : a study of process and microstructure
author_sort Zhang, X.
title Pulse electroplating of copper film : a study of process and microstructure
title_short Pulse electroplating of copper film : a study of process and microstructure
title_full Pulse electroplating of copper film : a study of process and microstructure
title_fullStr Pulse electroplating of copper film : a study of process and microstructure
title_full_unstemmed Pulse electroplating of copper film : a study of process and microstructure
title_sort pulse electroplating of copper film : a study of process and microstructure
publishDate 2012
url https://hdl.handle.net/10356/94840
http://hdl.handle.net/10220/8115
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