Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment

The global objective of this research endeavor is to inhibit the excessive growth of IMC and improve the properties of Sn-Ag-Cu lead-free solder alloy by adding small mount of Sb.

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Bibliographic Details
Main Author:	Chen, Binling
Other Authors:	Li Guoyuan
Format:	Theses and Dissertations
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:	https://hdl.handle.net/10356/5076
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-5076
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spelling	sg-ntu-dr.10356-50762020-06-01T12:02:02Z Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment Chen, Binling Li Guoyuan School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects The global objective of this research endeavor is to inhibit the excessive growth of IMC and improve the properties of Sn-Ag-Cu lead-free solder alloy by adding small mount of Sb. DOCTOR OF PHILOSOPHY (SME) 2008-09-17T10:19:22Z 2008-09-17T10:19:22Z 2005 2005 Thesis Chen, B. (2005). Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment. Doctoral thesis, Nanyang Technological University, Singapore. https://hdl.handle.net/10356/5076 10.32657/10356/5076 Nanyang Technological University 196 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
country	Singapore
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Chen, Binling Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment
description	The global objective of this research endeavor is to inhibit the excessive growth of IMC and improve the properties of Sn-Ag-Cu lead-free solder alloy by adding small mount of Sb.
author2	Li Guoyuan
author_facet	Li Guoyuan Chen, Binling
format	Theses and Dissertations
author	Chen, Binling
author_sort	Chen, Binling
title	Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment
title_short	Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment
title_full	Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment
title_fullStr	Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment
title_full_unstemmed	Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment
title_sort	study of interfacial reaction between cu and pb-free solders and rapid temperature cycling methodology for reliability assessment
publishDate	2008
url	https://hdl.handle.net/10356/5076
_version_	1681057591630757888

Study of interfacial reaction between Cu and Pb-free solders and rapid temperature cycling methodology for reliability assessment

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