Development of Pb-free solder for electronic assembly

This project aimed (1) to look for new lead-free solder alloy systems with improved properties for electronic packaging and assembly, (2) to study the effects of microstructural evolution on the reliability of the solder joints, and (3) to investigate the growth kinetics of the IMC formation in sold...

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Bibliographic Details
Main Author:	Li, Guoyuan.
Other Authors:	School of Materials Science & Engineering
Format:	Research Report
Published:	2008
Subjects:	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Online Access:	http://hdl.handle.net/10356/6781
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Institution:	Nanyang Technological University

id	sg-ntu-dr.10356-6781
record_format	dspace
spelling	sg-ntu-dr.10356-67812023-07-08T06:39:16Z Development of Pb-free solder for electronic assembly Li, Guoyuan. School of Materials Science & Engineering DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects This project aimed (1) to look for new lead-free solder alloy systems with improved properties for electronic packaging and assembly, (2) to study the effects of microstructural evolution on the reliability of the solder joints, and (3) to investigate the growth kinetics of the IMC formation in solder joints based on establishing new theoretical model. 2008-09-17T14:24:47Z 2008-09-17T14:24:47Z 2004 2004 Research Report http://hdl.handle.net/10356/6781 Nanyang Technological University 102 p. application/pdf
institution	Nanyang Technological University
building	NTU Library
continent	Asia
country	Singapore Singapore
content_provider	NTU Library
collection	DR-NTU
topic	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
spellingShingle	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects Li, Guoyuan. Development of Pb-free solder for electronic assembly
description	This project aimed (1) to look for new lead-free solder alloy systems with improved properties for electronic packaging and assembly, (2) to study the effects of microstructural evolution on the reliability of the solder joints, and (3) to investigate the growth kinetics of the IMC formation in solder joints based on establishing new theoretical model.
author2	School of Materials Science & Engineering
author_facet	School of Materials Science & Engineering Li, Guoyuan.
format	Research Report
author	Li, Guoyuan.
author_sort	Li, Guoyuan.
title	Development of Pb-free solder for electronic assembly
title_short	Development of Pb-free solder for electronic assembly
title_full	Development of Pb-free solder for electronic assembly
title_fullStr	Development of Pb-free solder for electronic assembly
title_full_unstemmed	Development of Pb-free solder for electronic assembly
title_sort	development of pb-free solder for electronic assembly
publishDate	2008
url	http://hdl.handle.net/10356/6781
_version_	1772825428734509056

Development of Pb-free solder for electronic assembly

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