Fracture properties of Sn-37Pb and Sn-3.5Ag solder joints

• 主要作者: Siow, Kim Shyong.
• 其他作者: Manoharan, Mohan
• 格式: Theses and Dissertations
• 語言: English
• 出版: 2008
• 主題: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
• 在線閱讀: http://hdl.handle.net/10356/13538
• 機構: Nanyang Technological University

Surface mount technology has increasingly become the industry norm and slowly replaced the pin through hole technique. This preference has led to a demand for higher quality solder joints. Besides the traditional role as an electrical connection, the joint needs to be able to act as a load bearing e...