Fracture properties of Sn-37Pb and Sn-3.5Ag solder joints

Surface mount technology has increasingly become the industry norm and slowly replaced the pin through hole technique. This preference has led to a demand for higher quality solder joints. Besides the traditional role as an electrical connection, the joint needs to be able to act as a load bearing e...

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Bibliographic Details
Main Author: Siow, Kim Shyong.
Other Authors: Manoharan, Mohan
Format: Theses and Dissertations
Language:English
Published: 2008
Subjects:
Online Access:http://hdl.handle.net/10356/13538
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Institution: Nanyang Technological University
Language: English

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