Interfacial study of electroless Ni-Sn-P plating and Sn-3.5Ag solder after multiple reflows
Electroless Ni-P plating has been a good candidate for Under Bump Metallization (UBM) in IC packaging due to its lower cost and slower chemical reaction with solder compared to Cu based UBM. However, during its reaction with Sn-based lead free solder, it faces the problem of rapid Ni out diffusion w...
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Format: | Final Year Project |
Language: | English |
Published: |
2009
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Online Access: | http://hdl.handle.net/10356/15307 |
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Institution: | Nanyang Technological University |
Language: | English |